Our Thermally Conductive Spacer materials feature high thermal conductivity (low thermal resistance) achieved by filling silicone resin or thermoplastics with a high content of our own ceramic fillers. Denka Thermally Conductive Spacers offer excellent adhesion to uneven surface interfaces in electronic parts such as CPUs and MPUs, and transfer the heat generated to heat-sinks with higher efficiency.
Denka Thermally Conductive Spacer products have been developed through careful selection of proprietary ceramic fillers and advanced loading techniques. Our know-how in the field of electronics translates to highly customized properties that achieve higher flexibility while matching thermal conductivity in products according to the application and purpose. Phase-change materials are also available, ensuring excellent adhesion between materials through temperature specific softening properties.
– PCs (MPU, chipset)
– Driver IC’s
– Digital home appliances (IC)
– Power supplies
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