OVERVIEW

ALSINKDenka ALSINK takes its name from its nature as a heatsink material based on a composite (MMC) of Al-SiC and ceramics. Our product is an excellent material characterized by low thermal expansion, high thermal conductivity, high strength, and weight reduction properties. These days, it is drawing attention in the market as a substitute for ceramics and metals like Al and Cu/Mo alloys demanding advanced thermal properties.

 

CHARACTERISTICS

Al-SiC has a coefficient of thermal expansion similar to that of alumina (Al2O3), and thermal conductivity as high as that of aluminum nitride (AIN), making it the most suitable material for heat dissipation applications. Its physical properties can be adjusted by selecting the type and content of ceramics. It can also be used in demanding applications requiring reliability, high-rigidity, and lightweight structural characteristics. Our ALSINK achieves excellent ease of fabrication and plating by coating the surface of MMC with a 10 to 150 μm Al-alloy layer.

 

APPLICATIONS

– Base boards for power modules such as IGBT and diodes that require high reliability (heat sinks)

– Heat-dissipating lids for semiconductor packages such as CPU’s (heat spreaders)

– Components for microwave devices such as optical and communication devices

– Components for semiconductor and LCD panel manufacturing equipment

 

Please contact sales@denka.us.com for any inquiry.